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Closing Keynote: Electrodeposition and Properties of highly (111)-oriented nanotwinnedCu and its applications in microelectronic packaging industry

Tuesday, September 17
4:00pm to 4:30pm

 

Abstract:

We can fabricate highly (111) nanotwinned Cu (nt-Cu) films by DC and pulsed electroplating. The nt-Cu possesses low resistivity, high thermal stability, high surface diffusivity, low oxidation rates, high electromigrationresistance, high fatigue resistance, and high toughness. Therefore, these properties make it suitable for the interconnects for 3D IC packaging. In this presentation, we will introduce its application in microelectronic packaging, including Cu-to-Cu direct bonding, high-strength and high-thermal-stability Cu lines for fan-out packaging.

 

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