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SiP Global Summit 2019 – Heterogeneous Integration NOW & FUTURE – Day 1 – Advanced Packaging Technology Symposium

Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park Tuesday, September 17
8:30am to 5:40pm

Date:Tuesday, September 17th, 2019
Time:08:30 - 17:40 (08:30-09:00 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park
Theme: Heterogeneous Integration Packaging Technologies and Smart Manufacturing for 5G & AI  Applications
Outline: (TBD)

 

 
Early-bird Original
NTD 5,040 NTD 6,300

*Tax Included

 
 

 

 
 
* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 

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