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SiP Global Summit 2019 – Heterogeneous Integration NOW & FUTURE – Day 1

Grand Ballroom, Grande Luxe Banquet, 3F, Building A, CTBC Financial Park Tuesday, September 17
8:30am to 5:50pm

Date:Tuesday, September 17th, 2019
Time:08:30 - 17:50 (08:30-09:00 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park
Theme: Heterogeneous Integration Packaging Technologies and Smart Manufacturing for 5G & AI  Applications

Forum Chairs:

  • Mr. Albert Lan, Global Packaging TD, Applied Materials/ Vice Chairman, SEMI Taiwan Packaging &Testing Committee

Moderators:

Outline: 

  • 5G (with mm-wave transition features) can effectively enable AI life and can be realized by the packaging technologies, such as SiP, Fan Out, 2.5D/3D TSV, and CoW/WoW hybrid bonding.
  • To address product applications, and its equipment & material technology solutions in advanced packaging, the forum have invited lots of experts from Fabless design house, IDM, Foundry, OSAT, Equipment and Materials suppliers to share their treasure experiences on future technology development roadmap, challenges, and effective solutions.
  • Beside investing in packaging techniques advancement for integrated applications, the driving trend is also to integrate into a full system of high performance and functionality devices with smart manufacturing. The connected system in packaging world shall drive for yield performance excellence in high-tech manufacturing.

 

 

Early-bird
(7/10-8/30)

Original
(8/31-9/20)

SEMI Member
(7/10-9/20)
Group Registration
(7/10-9/20)
NTD 5,040 NTD 6,300 NTD 5,040 Extra 10% discount
(More than 5 people)

*Tax Included

 
 

Sponsored by:

 

 

 
* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 

 

Do you want to attend this session? REGISTER NOW!

Mr. Richard Salsman
CFO and Vice President of Operations
SEMI
Mr. Santosh Kumar
Director & Principal Analyst
Yole Developpement
Dr. Shin-Puu Jeng
Director
TSMC
Mr. David Fang
CTO, Vice President ​
Powertech Technology Inc.
Dr. John H. Lau
CTO
Unimicron Technology Corporation
Mr. Markus M. Hoffmann
Head of Business Development Asia-Pacific
Zollner Elektronik AG
Mr. Chris Jones
Director, PVD Product Management
SPTS Technologies Ltd
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