MEMS & Sensors Forum

Room 504bc, 5F, TaiNEX 1 Tuesday, September 17
8:30am to 4:40pm

Date : Tuesday, September 17th ​, 2019
Time :  08:30 – 16:40 (8:30-8:55 for registration)
Venue :  Room 504bc, 5F, TaiNEX 1 
Theme :  Edge Sensing to Edge AI for Life


Human beings currently experience a fast-changing world, which is overwhelmed by artificial intelligence (AI) in all kinds of aspects, thus greatly influencing our life, and this is just the beginning. Although AI has been developed for several decades, its progress is not significant until miniaturized, high performance and cost-effective sensors available. However, there are still many challenges hindering the real implementation of AI into our life (i.e., edge or local), including handling of trillion raw data from sensors, limited bandwidth and speed of wireless communication, and insufficient capacity and calculation efficiency of cloud. As such, this brings “Edge Sensing to Edge AI for Life” to be the main theme of the 2019 SEMICON Taiwan MEMS & Sensors Forum. The invited presentations this year will unveil the state-of-the-art Edge technology and local intelligence in sensors, modules, and application scenarios, as well as their eco-systems such as edge computing, 5G communication, cloud, big data, algorithm, and AI layers, thus enabling a real Edge era. Foreseeing the trends enabled by the Edge era, the forum this year features four categories including automotive and AI/Applications/Smart Life, with excellent presentations offered by flagship companies worldwide.



SEMI Member Non-SEMI Member SEMI Member Non-SEMI Member
NTD1,800 NTD2,250 NTD2,250 NTD2,700

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* Forum agenda is subject to change    

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance









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Mr. Berthold Hellenthal
Head of Competence Center Electronics & Semiconductor
Mr. Mario Ibrahim
Technology & Analyst, Package Assembly Substrate
Yole Developpement
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