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To Deliver on the Promise of AI: AI chip test techniques and solutions for aggressive Time-to-Market and maximum test coverage

Thursday, September 19
3:05pm to 3:30pm

Abstract:
 
Across cloud infrastructure and edge applications, artificial intelligence has taken center stage. As AI chip companies look to deliver new products to market fast, with high yield and low DPPM, the need for a trusted ATE platform that provides unique features addressing AI testing is critical. This presentation will look at some of those solutions, including high current supply and thermal protection, high speed SERDES characterization and EDA link tools for silicon debug and bring up and how they help customers deliver on their promise of new AI chips.
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