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Programs Catalog

Special Features Grand Ballroom, 3F, Grand Hyatt Taipei Wednesday, September 18
6:00pm to 9:00pm
Test Room 505ab, 5F, TaiNEX 1 Thursday, September 19
9:00am to 9:30am

Date:Thursday, September 19th, 2019
Time:09:00 - 16:20 (09:00-09:30 for registration)
Venue:Room 505ab, 5F, TaiNEX 1
Theme: 5G & AI-assisted Test

Forum Chairs:

  • Dr. Cheng-Wen Wu, Executive Vice President, National Cheng Kung University/ Co-Chair, SEMI Taiwan Testing Committee
  • Mr. CJ Hsieh, General Manager, INTEL Innovation Tech. Ltd./ Co-Chair, SEMI Taiwan Testing Committee

Forum Vice Chair:

  • Ms. Wendy Chen, Associate Vice President, King Yuan Electronics Co., Ltd./ Vice Chair, SEMI Taiwan Testing Committee

Moderators:

  • Dr. Cheng-Wen Wu, Executive Vice President, National Cheng Kung University/ Co-Chair, SEMI Taiwan Testing Committee
  • Mr. CJ Hsieh, General Manager, INTEL Innovation Tech. Ltd./ Co-Chair, SEMI Taiwan Testing Committee

Outline: (TBD)

 

 
Early-bird
(7/10-8/30)
Original
(8/31-9/20)
Free Free

*Tax Included

 
 
Sponsored by:

 

   

 

 

 
 
* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 
       
       

 

 

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Special Features Room 505ab, 5F, TaiNEX 1 Thursday, September 19
9:00am to 4:20pm
Special Features Room 504bc, 5F, TaiNEX 1 Wednesday, September 18
11:30am to 11:50am
Wednesday, September 18 9:00am
Thursday, September 19
4:15pm to 4:45pm
Wednesday, September 18 10:00am

As silicon chips are reaching their limits, compound semiconductor seems to be the answer to the industry future! Compound Semiconductor Innovation Zone invites leading companies including Episil, Epi, WIN Semiconductors, GaN Systems, IQE to present the latest trend on 3D Sensing, LiDAR & Radar and Powertrain. Meanwhile, BMW i3 will be showcased at the scene to demonstrate the autonomous applications of compound semiconductor! (READ MORE)

 

EXHIBITORS                     

BMW

Electronic and Optoelectronic System Research Laboratories, ITRI

Episil Holding Inc.

GaN Systems Inc.

IQE Taiwan Corporation

Win Semiconductors Corp.

 

SPONSORS 

                                 

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Room 401, 4F, TaiNEX 1 Wednesday, September 18
8:30am to 11:55am

Date:Wednesday, September 18th, 2019
Time:08:30 - 11:55 (08:30-09:00 for registration)
Venue:Room 401, 4F, TaiNEX 1
Theme: (TBD)
Outline: (TBD)

 

 

Early-bird
(7/10-8/30)

Original
(8/31-9/20)

Free Free

*Tax Included

 
 
Sponsored by:

 

 

   

 

 

 
 
* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 
       
       
       

 

 

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Special Features Room 401, 4F, TaiNEX 1 Wednesday, September 18
8:30am to 11:55am
Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park Tuesday, September 17
9:00am to 5:00pm
SiP Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park Thursday, September 19
9:00am to 4:25pm
SiP Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park Friday, September 20
9:00am to 4:25pm
FUTURE Stage, 4F, TaiNEX 1 Wednesday, September 18
8:30am to 12:25pm

Date:Wednesday, September 18th, 2019
Time:08:30 - 12:20 (08:30-09:00 for registration)
Venue:FUTURE Stage, Booth #M1148, 4F, TaiNEX 1
Outline: 

Innovation is uncertain and could be risky, and yet it is also the biggest drive of technology invention and development which through the creative destruction led by innovation, we witness and experience remarkable changes and improvement of human life.

Behind every innovation, there are painstaking process with countless trial and error and there are also enlightening moments of epiphany.  What drives innovation to success, what we discover throughout the process and how future innovation looks like, we invite a series of distinguished speakers from worldwide leading research institute & academia who have made exceptional contributions to this industry to share their insights and visions. Facing innovative future, let’s learn, unlearn and relearn.

 

 

Early-bird
(7/10-8/30)

Original
(8/31-9/20)

free free

*Tax Included

 
 

 

 
 
* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 

View Full Agenda
Special Features Booth #M1148, FUTURE Stage, 4F, TaiNEX 1 Wednesday, September 18
8:30am to 12:25pm

Date:Wednesday, September 18th, 2019
Time:08:30 - 12:25 (08:30-09:00 for registration)
Venue:Future Stage, 4F, TaiNEX 1
Theme: (TBD)
Outline: 

Innovation is uncertain and could be risky, and yet it is also the biggest drive of technology invention and development which through the creative destruction led by innovation, we witness and experience remarkable changes and improvement of human life.

Behind every innovation, there are painstaking process with countless trial and error and there are also enlightening moments of epiphany.  What drives innovation to success, what we discover throughout the process and how future innovation looks like, we invite a series of distinguished speakers from worldwide leading research institute & academia who have made exceptional contributions to this industry to share their insights and visions. Facing innovative future, let’s learn, unlearn and relearn.

 

 
Early-bird Original
free free

*Tax Included

 
 

 

 
 
* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 

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Special Features URBAN331, 1F, Madison Taipei Hotel Thursday, September 19
5:30pm to 7:30pm
Special Features 1F & 4F, TaiNEX 1 Wednesday, September 18
10:00am to 5:00pm
Special Features 1F & 4F, TaiNEX 1 Thursday, September 19
10:00am to 5:00pm
Special Features 1F & 4F, TaiNEX 1 Friday, September 20
10:00am to 5:00pm
Special Features Booth #I2013a, 1F, TaiNEX 1 Friday, September 20
11:50am to 1:00pm
#K2988, ITRI, 1F, TWTC Nangang Exhibition Hall Thursday, September 19
2:00pm to 2:50pm
Special Features Booth #J2838, ITRI, 1F, TaiNEX 1 Thursday, September 19
1:00pm to 3:00pm
Wednesday, September 18 10:00am

Outgrow to Next Era! Heterogeneous Integration Innovation Zone will present you the key approach and terminal application on HI technology, ASE and other industry players from 5G, IC design, packaging, and silicon photonic fields to showcase the latest trend and the possible future of AI Chips!

 

ASE will present 2 videos about   2.5D & 3D  and  Fan Out Packaging :

2.5D & 3D  
2.5D & 3D technologies deliver enhanced performance, lower latency, increased bandwidth and power efficiency. ASE continues to push boundaries by innovating the 2.5D & 3D technologies. 

Fan Out Packaging 
Fan Out packaging continues to gain major prominence within the industry. ASE is evolving this packaging platform to meet application demands for smaller form factors and improved electrical and thermal performance. 

 

Exhibitors

ASE Inc.
Chunghwa Telecom
Powertech Technology Inc.
SiPlus Co., Ltd

 

 

   
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Special Features Booth #L0100a, 4F, TaiNEX 1 Thursday, September 19
12:20pm to 1:30pm
High-Tech Facility International Forum Room 402abc, 4F, TWTC Nangang Exhibition Hall Thursday, September 19
8:30am to 5:30pm

Date:Thursday, September 19th, 2019
Time:08:30 - 17:30 (08:30-09:00 for registration)
Venue:Room 402abc, 4F, TaiNEX 1
Theme: A.I. Solutions Shaping Future Facilities
Outline: 

The 4th Industrial Revolution has recently ignited the rising explosion of applying Artificial Intelligence (AI) from the horizon of technological evolution. Many are curious about "What is AI doing for smart fab facilities?" The High-Tech Facility International Forum 2019 is to bring IBM & nVidia frontier visionary with other global experts together to discuss how AI is being implemented in the world's most advanced smart fab.

With every new generation of smart fab comes the development of more advanced AI and delivering a broad base of the continuous improvement for semiconductor manufacturing. As results become feasible and evident, there is an urgent need to learn more about AI knowledge and to pragmatically implement its technologies for intelligenizing high tech fab facilities. This year's Forum aims to deliver the most current practice and trend of AI application to the attendees.

The Forum will provide real-time Chinese-English interpretation. The speakers and panel discussion participants will share recent findings and demands in a format that combines industry leaders with forefront researchers and representative suppliers. Thus, it publicly and sincerely makes direct communication among owners, suppliers and scholars for dealing with emerging issues. All are welcome to attend.

 

 

Forum Agenda:  http://www.htftaiwan.org/2019semicon.html
 
Early-bird
(7/10-8/30)

Original
(8/31-9/20)

NTD 4,200 NTD 4,600

*Tax Included

 
 

 

VIP Banquet 
Time : 18:00 - 21:00 
Venue:Ballroom, 3F, TaiNEX 1
 
 
Early-bird
(7/10-8/30)
Original
(8/31-9/20)
NTD 3,200 NTD 4,200
*Tax Included

 

 

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 

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Special Features Room 402abc, 4F, TaiNEX 1 Thursday, September 19
8:30am to 5:30pm
Special Features A Room, The Banquet Hall, 3F, TaiNEX 1 Thursday, September 19
5:30pm to 9:00pm
Room 401, 4F, TaiNEX 1 Friday, September 20
8:00am to 4:25pm

Date:Friday, September 20th, 2019
Time:08:00 - 16:25 (08:00-08:30 for registration)
Venue:Room 401, 4F, TaiNEX 1 (Taipei Nangang Exhibition Center, Hall 1)
Theme: A Big Thing in Semiconductor Indstry

Chair:

  • Dr. John Lin, Director, Taiwan Semiconductor Manufacturing Company Ltd./ Chairman, SEMI Taiwan IC Committee

Vice Chairs:

  • Mr. Rutgers Chow,  President of SPTS Asia, SPTS Technologies, Ltd./  Vice Chairman, SEMI Taiwan IC Committee
  • Mr. G.C. Hung, Vice President, United Microelectronics Corporation/ Vice Chairman, SEMI Taiwan IC Committee 

Moderator:

  • Mr. Kevin Liu, Vice President, Lam Research Corporation

Outline:

IC Forum is the global stage where industry leaders share their visions and perspectives on the roadmap of IC technology and how it enables various applications such as AI, quantum computing, HPC and 5G that keep advancing our industry.    

For this year's IC Forum, we are honored to have Microsoft, TSMC, UMC, imec and world leading equipment, materials and EDA companies to jointly address "A Big Thing in Semiconductor Industry."  "A Big Thing" could be a killer application like AI or autonomous driving, a breakthrough in chip design, and it could refer to the value of IC manufacturing in materializing all the innovation of applications through technology like scaling, specialty IC, new memory and heterogeneous integration.  

Through IC forum, we discuss trends, innovation and next generation manufacturing technology that advance the development of human life!

 

 
Early-bird
(7/10-8/30)
Original
(8/31-9/20)
NTD 3,200 NTD 4,000

*Tax Included

 
 
Sponsored by:

 

 

 

 

 

 
 
 

    * Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 

   

 

 

 

 

 
       

 

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Special Features Room 401, 4F, TaiNEX 1 Friday, September 20
8:00am to 4:20pm
FUTURE Stage, 4F, TWTC Nangang Exhibition Hall Friday, September 20
8:30am to 11:30am

Date:Friday, September 20th, 2019
Time:08:30- 11:30 (08:30-09:00 for registration)
Venue:FUTURE Stage, Booth #M1148, 4F, TaiNEX 1
Theme:Leap into the tech future

Outline:

Interested in a full update on the recent developments in the field of nanoelectronics? ITF Taiwan 2019  is your place to be.
Imec and SEMICON Taiwan invite you to the Taipei Nangang Exhibition Center, on September 20th  for a half-a-day program of exclusive insights into research and innovation topics such as advanced 3D scaling, silicon photonics, TDI and pixel imaging, quantum computing, and life sciences by renowned imec experts. Top-notch tech presentations to help you leap into the tech future.

Doors open at 8:30am.
Presentations from 9am till 11:30am

Make your visit to SEMICON Taiwan even more worthwhile!

 
 
 
 
 
Early-bird
(7/10-8/30)
Original
(8/31-9/20)
SEMI Member
(7/10-9/20)
Group Registration
(7/10-9/20)
Free Free Free Free

 

 
 

 

 
 
* Forum agenda is subject to change
 
 

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

Organized by:
     
 

 

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Special Features Booth #M1148, FUTURE Stage, 4F, TaiNEX 1 Friday, September 20
8:30am to 11:30am
IoT Room 402ab, 4F, TWTC Nangang Exhibition Hall Wednesday, September 18
9:00am to 12:00pm
Special Features Booth #J3258, 1F, TaiNEX 1 Thursday, September 19
2:30pm to 4:30pm
Market Trend Room 402ab, 4F, TaiNEX 1 Wednesday, September 18
9:00am to 12:20pm

Date:Wednesday, September 18th, 2019
Time:09:00 - 12:20 (09:00-09:30 for registration)
Venue:Room 402ab, 4F, TaiNEX 1 (Taipei Nangang Exhibition Center, Hall 1)
Theme: (TBD)

Moderator:

  • Mr. Steven Liu, Senior Vice President, United Microelectronics Corporation

Outline: (TBD)

 

 

Early-bird
(7/10-8/30)

Original
(8/31-9/20)

NTD 2,200 NTD 2,750

*Tax Included

 
 
Sponsored by:
   
     

 

 

 
 
* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 

View Full Agenda
Special Features Room 402ab, 4F, TaiNEX 1 Wednesday, September 18
9:00am to 12:20pm
Wednesday, September 18 10:50am
Special Features Booth #J3258, 1F, TaiNEX 1 Wednesday, September 18
10:30am to 4:30pm
Special Features Booth #J3258, 1F, TaiNEX 1 Thursday, September 19
10:30am to 4:30pm
Special Features Booth #J3258, 1F, TaiNEX 1 Friday, September 20
10:30am to 4:30pm
MEMS & Sensors Room 504bc, 5F, TaiNEX 1 Tuesday, September 17
8:30am to 4:40pm

Date : Tuesday, September 17th ​, 2019
Time :  08:30 – 16:40 (8:30-8:55 for registration)
Venue :  Room 504bc, 5F, TaiNEX 1 
Theme :  Edge Sensing to Edge AI for Life

Outline:

Human beings currently experience a fast-changing world, which is overwhelmed by artificial intelligence (AI) in all kinds of aspects, thus greatly influencing our life, and this is just the beginning. Although AI has been developed for several decades, its progress is not significant until miniaturized, high performance and cost-effective sensors available. However, there are still many challenges hindering the real implementation of AI into our life (i.e., edge or local), including handling of trillion raw data from sensors, limited bandwidth and speed of wireless communication, and insufficient capacity and calculation efficiency of cloud. As such, this brings “Edge Sensing to Edge AI for Life” to be the main theme of the 2019 SEMICON Taiwan MEMS & Sensors Forum. The invited presentations this year will unveil the state-of-the-art Edge technology and local intelligence in sensors, modules, and application scenarios, as well as their eco-systems such as edge computing, 5G communication, cloud, big data, algorithm, and AI layers, thus enabling a real Edge era. Foreseeing the trends enabled by the Edge era, the forum this year features four categories including automotive and AI/Applications/Smart Life, with excellent presentations offered by flagship companies worldwide.

 

 

Early-Bird
(7/-8/30)
Original
(8/31-9/20)
SEMI Member Non-SEMI Member SEMI Member Non-SEMI Member
NTD1,800 NTD2,250 NTD2,250 NTD2,700

*Tax Included

 

Sponsored by:
              

 

 

     

 
     
     
     
* Forum agenda is subject to change    
     
     

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 
              

 

   

 

 

 

View Full Agenda
Special Features Room 504bc, 5F, TaiNEX 1 Tuesday, September 17
8:30am to 4:40pm
Special Features Happiness, 3F, TaiNEX 1 Tuesday, September 17
11:25am to 1:00pm
Special Features Booth #K3276, 1F, TaiNEX 1 Thursday, September 19
10:30am to 12:00pm
Thursday, September 19
1:20pm to 1:30pm
Thursday, September 19
4:30pm to 5:00pm
Wednesday, September 18 9:00am

2019 Coming Soon!

View Full Agenda
Special Features B Room, The Banquet Hall, 3F, TaiNEX 1 Thursday, September 19
11:30am to 1:30pm
Power & Optoelectronics Semiconductor Room 401, 4F, TaiNEX 1 Thursday, September 19
8:00am to 4:40pm

 

Date:Thursday, September 19th, 2019
Time:08:00 - 16:40 (08:00-08:20 for registration)
Venue:Room 401, 4F, TaiNEX 1( Taipei Nangang Exhibition Center, Hall 1)

Theme:

  • Wide Band Gap Power Electronics ​
  • 5G Communications and VCSEL

Chair:

  • Mr. Brian Lee, CSO, Win Semiconductors Corp./ Chairman, SEMI Taiwan Power & Compound Semiconductor Committee

Vice Chairs:

  • Dr. Yi-Cheng Cheng, General Director, National Chung-Shan Institute of Science & Technology/ Vice Chairman, SEMI Taiwan Power & Compound Semiconductor Committee
  • Mr. Andy Chuang, President, Episil Technologies Inc./ Vice Chairman, SEMI Taiwan Power & Compound Semiconductor Committee
  • Dr. Barry Jia-Fu Lin, CTO, Wavetek Microelectronics Corporation/ Vice Chairman, SEMI Taiwan Power & Compound Semiconductor Committee

Moderator:

  • Mr. Andy Chuang, President, Episil Technologies Inc./ Vice Chairman, SEMI Taiwan Power & Compound Semiconductor Committee
  • Dr. Barry Jia-Fu Lin, CTO, Wavetek Microelectronics Corporation/ Vice Chairman, SEMI Taiwan Power & Compound Semiconductor Committee

Outline:

  • Energy saving and carbon reduction are two major topics in the area of environment protection of the  earth. WBG (Wide Band Gap) technology is one of best solution to enhance the efficiency of energy conversion, it can effectively make power electronics systems much smaller, lighter, more reliable and more efficient, while being capable of operating at higher temperatures. Compared to silicon devices and materials, wide band gap devices based on SiC and GaN have excellent characteristics to achieve a significant improvement in performance such as higher breakdown voltages, higher electron mobility and higher thermal conductivity.
    To popularize WBG power electronics, the forum will address WBG applications in EV industry, wide band gap materials, as well as manufacturing and process technologies for wide band gap devices.

  • 5G communication is rolling out to the field in the coming years. It changes the role of cell phone in a revolutionary way. Cell phone is no longer just a personal tool, it moves to an interaction media between human and environment through IOT connection. In this session, 5G technology and architecture trends will be reviewed by two prominent vendors in the world.
    VCSEL emerges as the “hot shot” in photonics area. In addition to the technology, component module, epi-wafer growth, and on-wafer testing are the other three key areas. Companies in Taiwan play a vital role in providing these key elements.  We will show case some examples in this session.
    In this session, topics on 5G communication and VCSEL demonstrate the impact of compound semiconductor industry on our daily life in the future.

 
 
 
 
 
Early-bird
(7/10-8/30)
Original
(8/31-9/20)
SEMI Member
(7/10-9/20)
Group Registration
(7/10-9/20)
NTD 3,200 NTD 4,000 NTD 3,200

Extra 10% discount
(More than 5 people)

*Tax Included

 
 
Co-organizer:
   
     

 

Partner:
   
     

 

 
Sponsored by:

 

 

 

 

 

 

 

 

   

 

 
 
* Forum agenda is subject to change
 
 
If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 
       

 

View Full Agenda
Special Features Room 401, 4F, TaiNEX 1 Thursday, September 19
8:00am to 4:40pm
Room 504bc, 5F, TaiNEX 1 Thursday, September 19
1:00pm to 5:00pm

Date:Thursday, September 19th, 2019
Time:13:00 – 17:00 (13:00-13:30 for registration)
Venue:Room 504bc, 5F, TaiNEX 1 
Theme: Envision the New Era of Computing
Outline:

The first quantum revolution is that scientists and tech engineers use the rules of quantum mechanics to build devices including the transistor, the laser, integrated circuit etc. The second quantum revolution is that we are directly using quantum machine including quantum sensor, quantum information and quantum computer. The quantum computer bases on quantum mechanics and gives the new computing that promise to solve some of the currently intractable problems. 

Quantum computer had a lot of potential applications including predictions of new medicine and new material, optimization, quantum machine learning for Artificial intelligence, financial problems, cryptography and so on. The first commercial quantum computer has been established by IBM in this year and it is can be predict that the quantum computer will be rapid development. Also recent two years more than hundred private and startup companies have been found. It is time to connect the future, the quantum era.

 

Early-Bird
(7/10-8/30)
Original
(8/31-9/20)
SEMI Member Non-SEMI Member SEMI Member Non-SEMI Member
FREE FREE FREE FREE

 

 

Organizer:
                      
     
     
     
     
* Forum agenda is subject to change
 
 

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 
View Full Agenda
Special Features Room 504bc, 5F, TaiNEX 1 Thursday, September 19
1:00pm to 5:00pm
Special Features Booth #I3216, Smart Workforce Pavilion, 1F, TaiNEX 1 Friday, September 20
1:30pm to 3:00pm
Booth #I3216, Smart Workforce Pavilion, 1F, TaiNEX 1 Friday, September 20
1:30pm to 3:00pm

Date:Friday, September 20th, 2019
Time:13:00 - 15:25 (13:00-13:30 for registration)
Venue:Booth #I3216, Smart Workforce Pavilion, 1F, TaiNEX 1

-Strategy Thinking in Era of Digital Transformation 
-Vision for Building a Digital Workforce Experience 
-Preparation for the AI Revolution in Workforce Development 

Outline: 

How do you prepare for a 21st century workforce? How to be competitive in the Era of Digital Transformation? SEMI Talent Forum will focus on developing what we can do to be ready in the career and how to attract and retain the best talent in the industry to lead the future!

 

Panel Discussion
-Strategy Thinking in Era of Digital Transformation 
-Vision for Building a Digital Workforce Experience 
-Preparation for the AI Revolution in Workforce Development 

Moderator

Mr. Eugene Huang, Partner, Deloitte Consulting

Panelist
1. Ms. Fiona Tan, Intel Taiwan Senior  HR Manager, Intel 
2. Mr. Leon Lu
, Chief of Adm. & HR, Wistron Corporation.

 

 

* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

View Full Agenda
Booth #M1156, Master Forum Stage, 4F, TWTC Nangang Exhibition Hall Wednesday, September 18
9:00am to 9:30am
Special Features Booth #M1148, FUTURE Stage, 4F, TaiNEX 1 Wednesday, September 18
8:30am to 9:30am
Special Features Grand Ballroom II, 3F, Grand Hyatt Taipei Monday, September 16
1:00pm to 3:30pm
Room 505a, 5F, TWTC Nangang Exhibition Hall Friday, September 20
8:30am to 4:15pm

Date:Friday, September 20th, 2019
Time:08:30 - 16:15 (08:30-09:00 for registration)
Venue:Room 505a, 5F, TaiNEX 1 / 台北南港展覽館一館 5樓 505a會議室
Theme:  Inspection and Metrology Technologies Improving Semiconductor Manufacturing
Outline:  The Semiconductor Advanced Inspection and Metrology Forum is focusing on technologies of inspection and metrology which affect the semiconductor manufacturing significantly and drive the growth of market. The global market of semiconductor inspection equipment is expected to reach US$ 5300 million by 2024, from US$ 3360 million in 2019. To facilitate the development of semiconductor inspection and metrology, SEMI Inspection and Metrology Committee has been established. The committee and this forum provide a platform for communications and aim to create the advanced solutions of inspection and metrology for semiconductor industry.

View Full Agenda
Special Features Room 505a, 5F, TaiNEX 1 Friday, September 20
8:30am to 4:15pm
SiP, SiP Global Summit Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park Tuesday, September 17
8:30am to 5:40pm

Date:Tuesday, September 17th, 2019
Time:08:30 - 17:40 (08:30-09:00 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park
Theme: Heterogeneous Integration Packaging Technologies and Smart Manufacturing for 5G & AI  Applications
Outline: (TBD)

 

 

Early-bird
(7/10-8/30)

Original
(8/31-9/20)

NTD 5,040 NTD 6,300

*Tax Included

 
 

Sponsored by:

       

 

 
* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 

View Full Agenda
SiP, SiP Global Summit Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park Thursday, September 19
8:15am to 5:00pm

Date:Thursday, September 19th, 2019
Time:08:15 - 17:00 (08:15-08:45 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park
Theme: AI/5G-driven High Performance Computing, from Cloud to Edge
Outline: 

With the arrival of data-centric era, we are unconsciously immersed in and guided by ubiquitous data generation and processing in our daily life; from remote cloud, data centers, networks, to fleet of personal and sensing devices such as smartphone, wearables, visual monitoring, vocal controls, and smart surveillance. This spurs strong demands on semiconductor logics, memories, and wireless connectivity for data generation, storage, processing, and communication. To meet the escalating demands on data bandwidth and smart computing, the semiconductor industry has re-invented packaging and system integration technologies by providing cost effective solutions in all application domains.

While Moore’s Law transistor scaling continues, semiconductor market has evolved from device centric to data centric. To address market needs, system packages through heterogeneous integration has taken the driver’s seat and  propel system performances toward smart computing, wide data bandwidth, small form factor, with low or zero latency and energy efficiency. And all these are capped by ever better system cost per function as technology and product migrate from generation to generation.

In this forum, speakers from renowned academician, research institute, Design House, EDA tool, foundry, and manufacturing/materials suppliers are sharing their insights and visions. Audience would benefit from this forum to have an in-depth understanding on following subjects

  • Data centric high performance computing industry trends
  • System integration and packaging technologies
  • Chiplets integration: opportunity and challenges
  • Novel enablement ASIC, EDA, and manufacturing tools/materials

 

 

Early-bird
(7/10-8/30)

Original
(8/31-9/20)

NTD 5,040 NTD 6,300

*Tax Included

 
 
Sponsored by:

 

 

 

 

   

 

 

 
 
* Forum agenda is subject to change

 

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 

   
View Full Agenda
Special Features Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park Thursday, September 19
8:30am to 4:55pm
SiP, SiP Global Summit Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park Friday, September 20
8:30am to 5:00pm

Date:Friday, September 20th, 2019
Time:08:30 - 16:40 (08:30-09:00 for registration)
Venue:Grand Ballroom, Grand Luxe Banquet, 3F, Building A, CTBC Financial Park 
Theme: Hybrid: Heterogeneous & Homogeneous
Outline: (TBD)

 

 
Early-bird
(7/10-8/30)
Original
(8/31-9/20)
NTD 5,040 NTD 6,300

*Tax Included

 
 
Sponsored by:

 

 

 

 

 

 
 
* Forum agenda is subject to change

 

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
View Full Agenda
SMART Data Room 504bc, 5F, TaiNEX 1 Thursday, September 19
8:30am to 12:15pm

Date:Thursday, September 19th, 2019
Time:08:30 – 12:15 (8:30-8:55 for registration)
Venue:Room 504bc, 5F, TaiNEX 1 
Outline:

Artificial intelligence is permeating everybody’s lives through the face recognition, voice recognition, image analysis and natural language processing capabilities built into their smartphones, consumer and industrial appliances.  However, as traditional processors struggle to meet the demands of compute-intensive artificial intelligence applications, dedicated AI chips are playing an increasingly important role in research, development, and on the cloud and edge. 

With its potential market of hundreds of zettabytes and $2 trillion of on top of the existing $1.5-2B information technology industry, AI not only relies on new semiconductor architectures and compute platforms but also brings many growth opportunities for new semiconductor products where new approaches to designs are required because of the complexity of the applications that need to be supported. Join to learn these industry executives’ vision leading the way forward to a fully connected, intelligent world.

 

Early-Bird
(7/10-8/30)
Original
(8/31-9/20)
SEMI Member Non-SEMI Member SEMI Member Non-SEMI Member
FREE FREE FREE FREE

 

* Forum agenda is subject to change    

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

   

View Full Agenda
Special Features Room 504bc, 5F, TaiNEX 1 Thursday, September 19
8:30am to 12:15pm
SMART Manufacturing Room 401, 4F, TWTC Nangang Exhibition Hall Wednesday, September 18
1:00pm to 4:55pm

Date:Wednesday, September 18th, 2019
Time:13:00 - 16:55 (13:00-13:30 for registration)
Venue:Room 401, 4F, TaiNEX 1
Theme: Leading the New Era of Intelligent Manufacturing with AI, Big Data & Cloud
Outline: (TBD)

 

 
Early-bird
(7/10-8/30)
Original
(8/31-9/20)
SEMI Member
(7/10-9/20)
Group Registration
(7/10-9/20)
NTD 2,000 NTD 2,500 NTD 2,000 Extra 10% discount
(More than 5 people)

*Tax Included

 
 
Sponsored by:

 

 

 

 

 
 
* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 
       
       

 

 

View Full Agenda
Special Features Room 401, 4F, TaiNEX 1 Wednesday, September 18
1:00pm to 4:55pm
Special Features B Room, The Banquet Hall, 3F, TaiNEX 1 Wednesday, September 18
11:30am to 1:30pm
SMART MedTech Room 504bc, 5F, TaiNEX 1  Friday, September 20
8:30am to 12:00pm

Date:Friday, September 20th , 2019
Time:08:30 – 11:00 (8:30-8:55 for registration)
Venue:Room 504bc, 5F, TaiNEX 1 
Theme: Create New Value Chain to Empower Medical Technology
Outline:

According to Global Market Insights, Inc., the global digital health market was valued at USD 86 billion in 2018 and expected to grow at a CAGR of 38.8% over the next seven years, expected to reach USD 504  billion in 2025. Rapidly advancing technologies , including artificial intelligence (AI), machine learning, Robotics,  IoT and wearables, etc. are impacting and accelerating health care industry. Smart MedTech can advance health care quality, improver data controls, decisions making in treatment or pharma and precision medicine, all these require the collaboration between microelectronics and health care industry. 

For microelectronics industry, it’s essential to understand the health care industry’s expectation and provide reliable, efficient and cost-effective solutions to increase the market size. As for health care industry, MedTech comes with immense opportunities to take advantage of latest technologies and  to boost the technology advancement. The close collaboration between these two industries definitely bring the bright future for human life.

The Smart MedTech forum not only initiate the communication between microelectronics industry with MedTech applications, but also accelerate semiconductor industry involvement in MedTech development and invest more resource to realize Smart MedTech.

 

Early-Bird
(7/10-8/30)
Original
(8/31-9/20)
SEMI Member Non-SEMI Member SEMI Member Non-SEMI Member
Free Free NTD1,800 NTD2,250

*Tax Included

* Forum agenda is subject to change    

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

   

View Full Agenda
Special Features Room 504bc, 5F, TaiNEX 1 Friday, September 20
8:30am to 12:00pm
SMART Transportation Room 504bc, 5F, TaiNEX 1 Wednesday, September 18
8:30am to 4:20pm

Date : Wednseday, September 18th , 2019
Time :  08:30 – 16:00 (8:30-8:55 for registration)
Venue :  Room 504bc, 5F, TaiNEX 1 
Theme :  From Silicon to Future Mobility

 

Early-Bird
(7/10-8/30)
Original
(8/31-9/20)
SEMI Member Non-SEMI Member SEMI Member Non-SEMI Member
NTD1,800 NTD2,250 NTD2,250 NTD2,700

*Tax Include

 

Co-organizer:
                    
     
     
Sponsored by:    
                       
     
     
Media Partner :    
   
* Forum agenda is subject to change
 
 

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 
View Full Agenda
Special Features Room 504bc, 5F, TaiNEX 1 Wednesday, September 18
8:30am to 4:20pm
Special Features A Room, The Banquet Hall, 3F, TaiNEX 1 Wednesday, September 18
11:30am to 1:30pm
Materials Booth #M1148, FUTURE Stage, 4F, TaiNEX 1 Thursday, September 19
8:30am to 5:00pm

Date:Thursday, September 19th, 2019
Time:08:30 - 17:00 (08:30-09:00 for registration)
Venue:FUTURE Stage, Booth #M1148, 4F, TaiNEX 1
Theme: Materials Leading the Smart Future of Semiconductor - Device Performance

Chair:

  • Mr. Min-Te Chen, Deputy Director, Taiwan Semiconductor Manufacturing Company Limited/ Chairman, SEMI Taiwan Materials Committee

Vice Chairs:

  • Dr. Joe Wu, Deputy Director, Taiwan Semiconductor Manufacturing Company Limited/ Vice Chairman, SEMI Taiwan Materials Committee 
  • Dr.  Jeffrey Yang, Senior Department Manager, Advanced Semiconductor Engineering Inc. (ASE Group)/ Vice Chairman, SEMI Taiwan Materials Committee
  • Mr. Brian Chen, Vice President, Wah Lee Industrial Corp. / Vice Chairman, SEMI Taiwan Materials Committee 

Outline: (TBD)

 

 
Early-bird
(7/10-8/30)
Original
(8/31-9/20)
NTD 2,500 NTD 3,125

*Tax Included

 
 
Sponsored by:

 

 

 

 

 

 

 

 

 

 

 

   

 

 

 
 
* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 

 

 

 

 

 

 

 

 

 

 

 

View Full Agenda
Special Features Booth #M1148, FUTURE Stage, 4F, TaiNEX 1 Thursday, September 19
8:30am to 5:00pm
Sustainable Manufacturing and Circular Economy Forum Room 505ab, 5F, TaiNEX 1 Wednesday, September 18
12:40pm to 5:00pm

Date:Wednesday, September 18th, 2019 
Time : 12:40 – 17:00 (12:40-13:00 for registration)
Venue:Room 505ab, 5F, TaiNEX 1 (Taipei Nangang Exhibition Center, Hall 1)
Theme :  Energy Conservation and Risk Management for Sustainable Manufacturing

Outline :

In conjunction with SEMICON Taiwan 2019, the Sustainable Manufacturing Committee of SEMI Taiwan is organizing an event to provide insights on the latest products and technologies, regulations, technical standards, business continuity plan (BCP), business continuity management (BCM), energy conservation, circular economy and cyber security.

The Sustainable and Circular economy Forum will showcase the expertise and capabilities of companies and speakers from around the word by addressing a wide variety of energy conservation and risk management issues for high tech sustainable manufacturing. The topics includes environmental protection, BCP/BCM, energy conservation, circular economy, occupational health and safety, information and operation security which affect sustainable manufacturing.

 

Early-bird
(7/10-8/30)
Original
(8/31-9/20)
SEMI  Member​
(7/10-9/20)
Non-SEMI Member​
(7/10-9/20)
Free Free Free Free

*Tax Included

 

 

Sponsored by:

     

 

   

 

    * Forum agenda is subject to change    

 

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 

 
View Full Agenda
Special Features Room 505ab, 5F, TaiNEX 1 Wednesday, September 18
12:40pm to 5:00pm
Special Features Booth #L1216, 4F, TaiNEX 1 Friday, September 20
2:00pm to 3:30pm
Special Features Booth #I3216, Smart Workforce Pavilion, 1F, TaiNEX 1 Thursday, September 19
1:30pm to 3:00pm
Booth #I3216, Smart Workforce Pavilion, 1F TaiNEX 1 Thursday, September 19
1:30pm to 3:00pm

 

Date:Thursday, September 19th, 2019
Time:13:00 - 15:00 (13:00-13:30 for registration)
Venue:Booth #I3216, Smart Workforce Pavilion, 1F, TaiNEX 1 
Theme: How to Land on the Dream Job and Change the Future ? 

Outline: 

The SMART Workforce Pavilion is where you’ll find the information you need to see where you fit in, and access the resources to get in the game and jumpstart your career. Come and network with industry professionals, discover career options and learn how you can contribute to the growth of an exciting industry.

Meet the Expert Stage you will see Talent Development Program with experts from Micron, TEL, Airoha, Spirox to discuss about “ How to Land on the Dream Job and Change the Future”. Join us to register and network with these experts!


Panel Discussion
Theme: How to Land on the Dream Job and Change the Future ? 

Moderator

Mr. Jason Shin, Senior Vice President of Executive Recruiting Consultancy Division, 104 Corporation

Panelists

1. Ms. Jessie Liu, Taiwan Country HRBP Director, Micron Technology Taiwan, Inc. 
2. Mr. Richard Li, Vice President, Spirox 

3. Mr. Yi Te Chu, HR Div. Director,  Airoha Technology Corporation    
4. 
Mr. Roger Chang, Executive Vice President, Tokyo Electron Taiwan
              

 
* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance


View Full Agenda
Tuesday, September 17 9:00am
Booth #M1148, FUTURE Stage, 4F, TaiNEX 1 Wednesday, September 18
1:20pm to 5:00pm

 

Date:Wednesday, September 18th, 2019
Time:13:20 - 17:00 (13:20-13:50 for registration)
Venue:FUTURE Stage, Booth #M1148, 4F, TaiNEX 1
Theme:Envision the Next 60 Years of Prosperity
Outline:
SEMICON Taiwan is an annual grand event connecting the ecosystem of microelectronics and semiconductor industry. The most up-to-date design, manufacture and applications are showcased in this exhibition.  As one of the highlights in SEMICON Taiwan, Technology Think Tank Summit gathers global industry leaders to share their opinions and visions on the industry future. Taiwan has laid a solid foundation within the 60 years of IC inventions. We invite industry leaders in SiP, IC design, memory, wafer fabrication, packaging and testing, and Minister Shen to discuss and provide guidance on how Taiwan can create another 60 brilliant years while facing global competition and changes.

 
 
 
 
 
Early-bird
(7/10-8/30)
Original
(8/31-9/20)
SEMI Member
(7/10-9/20)
Group Registration
(7/10-9/20)
FREE FREE FREE

FREE

*Tax Included

 
 
 
Sponsored by:
 
     

 

 
 
* Forum agenda is subject to change
 
 
If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

 
 
   
     

 

View Full Agenda
Special Features Booth #M1148, FUTURE Stage, 4F, TaiNEX 1 Wednesday, September 18
1:20pm to 5:00pm
TWTC Nangang Exhibition Hall Wednesday, September 18 11:00am

Advanced Materials Technology High-Tech Facility Innovative Technology & Product 

 

 Sept 18, 2019

TechXPOT 1F #K3276

Time Company Topic Language
12:20 -12:40  GrandiT Co., Ltd. Insights of Electronic Chemical Materials in China ZH
13:00 -13:20 Chongqing Qunwin Electronic Materials Co.,Ltd Nano Alloy: A New Material for High Power Semiconductor Devices Packaging ZH
13:20 -13:40 ANGUS CHEMICAL COMPANY ANGUS VOLTEN Offerings for Electronic Process ZH
13:40 - 14:00 NAMICS CORPORATION Copper foil surface treatment technology and low dielectric materials for high-speed transmission EN
14:00 - 14:20 Shanghang Zijin Jiabo Electronic New Material Technology Co.,Ltd. Study on alloy wire and copper wire ZH
14:20 - 14:40 Heraeus Materials Technology Taiwan Ltd. Secure Your Key To Future Power Electronics ZH
14:40 - 15:00 Evertech Enterprise Co., Ltd. Introduction of "Evertech" and the products ZH
15:00 - 15:20 Arkema (China) Investment Co., Ltd. ARKEMA KYNAR® PVDF For High Purity Industry ZH
15:20 - 15:40 Henan Guoxi Ultrapure New Materials Co.,ltd Applications of Ultra High Purity Metals in Semiconductor Field ZH
15:40 - 16:00 5N Plus Inc., Micro Powders Ultra-Fine Metal Powders for a Wide Range of Microelectronic Assemblies EN

 

TechXPOT 4F #L1216

Time Company Topic Language
10:40 - 11:00 Schneider Electric Taiwan Co., Ltd. Presentation by Schneider Electric Taiwan Co., Ltd.  
11:00 - 11:20 JUSUN INSTRUMENTS CO. LTD. The Innovation Technology for AMC/Ambient & Stack Gases compositions and PM2.5 ZH
11:20 - 11:40 New Fast Technology Co.,Ltd.  Intelligent On-line AMC Monitoring Technical Conclude in Fab ZH
11:40 - 12:00 TECHGO INDUSTRIAL CO., LTD. The Reserch and Design of Modular Structure for Cooling Tower ZH
12:00 - 12:20 SEMI Taiwan High-Tech Facility Committee NTUT-A total solution of contamination control for wafers in a FOUP when FOUP door is in open condition. ZH、EN
13:20 - 13:40 Vertiv Taiwan Co. Ltd. HIGH EFFICIENCY MODES OF OPERATION--Path toward highest energy efficiency without load availability trade-off ZH
13:40 - 14:00 Greenfiltec Ltd. Evolution and the future of chemical filter in MAU ZH
14:00 - 14:20 Wholetech System Hitech Limited Dust control technology for Process exhaust gas ZH
14:40 - 15:00 GEMUE Taiwan Ltd. WHAT DO SKYSCRAPERS AND MICROCHIPS HAVE IN COMMON? FOCUS ON THE SEMICONDUCTOR INDUSTRY. ZH
15:00 - 15:20 Trusval Technology Co., Ltd. Moving Towards Sustainable Manufacturing: Trusval Solutions and the Upcoming Trend in Semiconductor Field ZH
15:20 - 15:40 ECI Technology Inc Next generation Chemical process control in Semiconductor Industry EN
15:40 - 16:00 YeSiang Enterprise Co., Ltd. The Best AMC Solution in PostMoore Law Era ZH
16:00 - 16:20 JACOBI CARBONS AG Semiconductor Gas Filtration Challenge EN

 

 

 

 Sept 19, 2019

TechXPOT 1F #K3276

Time Company Topic Language
10:30 - 12:00 Instrument Technology Research Center NARLabs 2019 ASEPT Seminar ZH
13:30 - 14:00 CONNECTEC JAPAN Presentation by CONNECTEC JAPAN  
15:00 - 15:30 Manz Taiwan Ltd. Manz's Solution in FOPLP RDL Formation ZH
11:10 - 11:30 Indium Corporation The Challenge and Solution on Flip-chip and BGA Ball Mount Process ZH

 

TechXPOT 4F #L1216

Time Company Topic Language
10:30 - 11:00 SGS Taiwan Ltd. New Development on Qualification and Reliability Assessment of Microelectronic Products for Chemicals of the Semiconductor Process and Automotive Applications EN
11:00 - 11:30 3S Silicon Tech., Inc. Residue Free & Low Void — Formic Acid Vacuum Reflow Oven EN
11:30 - 12:00 SilcoTek Corporation CVD Coatings to Control Metal-Ion and Particulate Contamination EN
13:30 - 14:00 INTEKPLUS CO., LTD. TAIWAN BRANCH Presentation by INTEKPLUS CO., LTD. TAIWAN BRANCH  
14:00 - 14:30 EVG-JOINTECH CORP. SmartNIL™ Nanoimprint Lithography enabling advanced functionality of optical devices for AR EN

 

 

 Sept 20, 2019

TechXPOT 1F #K3276

Time Company Topic Language
10:20 - 10:50 Nanoelectronics Research Institute, National Institute of Advanced Industrial Science and Technology (AIST) Packaging in Minimal Fab EN
10:50 - 11:10 NIHON SUPERIOR (Taiwan) Co., LTD Low temperature sintering Nano Silver and SN100C Solder total solution ZH
11:10 - 11:40 PBI advanced materials Co.,Ltd. Ultra high heat resistance materials ZH
13:30 - 13: Daxin Materials Corp. Multi-functional TBDB Material Solutions for Advanced Packaging Technologies ZH
13:50 - 14:10 Yuhon Enterprise Corporation The application of Conductive Paste EN

 

TechXPOT 4F #L1216

Time Company Topic Language
10:20 - 10:40 SEMI Taiwan High-Tech Facility Committee MOST Sponsored R&D on Mitigating Magnetic Interference for High-Tech Fab Facilities. ZH
11:20 - 11:40 RAYZHER Industrial CO., LTD High-tech Fab & facility Planning and Design ZH
11:40 - 12:00 Joy Allied Technology Inc. The Pre-stage equipment for analysis of heavy metals on wafer surfaces and chemicals bath. A new patent invention with safe and fast equipment has zero background. The PDT system easily can transfer all kinds of acids or base to meters or few hundred meters within a minute. The samples will directly go to ICP MS. ZH

 

 

View Full Agenda
Special Features Booth #K3276, 1F, TaiNEX 1 Wednesday, September 18
12:20pm to 4:00pm
Special Features Booth #K3276, 1F, TaiNEX 1 Friday, September 20
10:20am to 3:10pm
Special Features Booth #K3276, 1F, TaiNEX 1 Thursday, September 19
12:00pm to 4:30pm
Special Features Booth #L1216, 4F, TaiNEX 1 Wednesday, September 18
10:40am to 4:40pm
Special Features Booth #L1316, 4F, TaiNEX 1 Thursday, September 19
10:30am to 4:30pm
Special Features Booth #L1216, 4F, TaiNEX 1 Friday, September 20
10:20am to 1:00pm
Special Features Booth #K2041a, 1F, TaiNEX 1 Thursday, September 19
11:50am to 1:00pm
Thursday, September 19
4:35pm to 4:50pm
Friday, September 20
2:25pm to 2:50pm
Special Features Happiness, 3F, TaiNEX 1 Wednesday, September 18
12:25pm to 1:50pm
Welcome Remarks by SEMI Executive:
Wednesday, September 18
8:55am to 9:00am
Special Features Booth #I3216, Smart Workforce Pavilion, 1F, TaiNEX 1 Friday, September 20
10:00am to 11:30am
Booth #I3216, Smart Workforce Pavilion, 1F, TaiNEX 1 Friday, September 20
10:00am to 11:30am

 

Date:Friday, September 20th, 2019
Time:10:00 - 13:30 (10:00-10:10 for registration)
Venue:Booth #I3216, Smart Workforce Pavilion, 1F, TaiNEX 1 
Theme: Empowering Women for the Future 
Outline: 

Our industry’s future success is dependent on innovation, diversity and inclusion of the best ideas in the world. Panelists from various categories comprising suppliers and customers will discuss key challenges they encountered, success stories, and ideas for how each company can increase ownership diversity across the semiconductor industry. Join us to understand more about “Empowering Women in the Future” at Women-in-Tech Forum!

 

Theme

Empowering Women for the Future 

Moderator

 Dr. Tri-Rung Yew, Professor, Department of Materials Science and Engineering , National Tsing Hua University

Panelists
1. Ms. Nina Lin, General Manager, Taiwan & ASEAN, Mentor, a Siemens Business
2.
Dr. Hedy Ho, Chief of Marketing and Operations , Microsoft Taiwan 
3. Ms. Julia Lu, Chief of Staff ,Semiconductor Products Group Taiwan, Japan, and China, Sales & Marketing,Applied Materials Taiwan

 

* Forum agenda is subject to change

If SEMI should be unable to hold the exhibition/forum for any cause beyond its reasonable control, SEMI has the right to cancel the exhibit/forum with no further liability than a refund of the ticket price. SEMI shall in no event be liable for incidental or consequential damages to registrants arising from or relating to such cancellation.

For further information, please visit our website. http://www.semicontaiwan.org/en/agenda-glance

View Full Agenda

Contact
SEMI Taiwan
Ms. Lily Lee
TEL: 886.3.560.1777 EXT. 509
Email: llee@semi.org

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