Dr. Kuo-Chung Yee

Director General
Taiwan Semiconductor Manufacturing Company Limited



  • Ph.D. Mechanical Engineering, University of Texas at Austin


  • Advanced Packaging, ASE CR&D
  • SEMITaiwan PKG & TEST Committee
  • ECTC  Packaging TechnologiesCommittee
  • ChinaSociety of Engineers Distinguished Engineer Award
  • 50 + US patents


Dr. KC Yee is currently a R&D Director of TSMC advanced Integrated Interconnect & Packaging. He received his Ph.D. degree from the Department of Mechanical Engineering at the University of Texas at Austin. He has 19+ years of semiconductor experiences in advanced IC packaging including optical MEMS, optoelectronics, advanced flip chip, wireless connectivity module, 3D IC, and wafer level fan-out. He owned/ co-owned 50+ granted US patents.

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