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Keynote: 3D IC Industry And Technology Trend – An EDA Perspective​

Thursday, September 19
10:10am to 10:45am

 

Abstract:

With packaging being advanced to 3D stacking technology, the high density packaging solutions require a new thought and planning from the design automation tools. In this talk, we will present our thoughts and will like to collaborate with the participants in this area tohandethe challenges in front of us.

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