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Mr. Way Shing Lee

Vice President
Qualcomm

 

Education :

  • Master of Science in Electrical Engineering, Stanford University

Experience :

  • Built the Qualcomm Reference Design team (QRD) in Shanghai which enabled the mobile device ecosystem to accelerate the 3G/4G transition in China.
  • Contributed to CDMA/EVDO, WCDMA, Application processor in DSP, 3GPP2 and 3GPP which helped to broaden the scope and connected applicable technology to mass market utilization.

Biography :

Way-Shing Lee serves as Vice President of Technology for Qualcomm Technologies, Inc. (QTI ) and has been focused on promoting and driving 5G progression for the last few years. 

Way-Shing joined Qualcomm in 1994. He led a notable career which debuted externally with commercial launch of EVDO Rev.A partnering with KDDI in Japan. Among his recent achievements, he built the Qualcomm Reference Design team (QRD) in Shanghai which enabled the mobile device ecosystem to accelerate the 3G/4G transition in China. His past contributions to CDMA/EVDO, WCDMA, Application processor in DSP, 3GPP2 and 3GPP has helped to broaden the scope and connected applicable technology to mass market utilization. His time spent with Chinese operators contributed to rapid and smooth transition from 3G to 4G in 2014 and further ongoing modem advanced technology spanning LTE Advanced Pro and 5G NR.  He has very wide grasp to broad subjects such as A.I., CV2X, XR, and Industrial IoT.

Way-Shing Lee holds a bachelor’s degree in Electrical Engineering from National Taiwan University and a master’s degree of Electrical Engineering from Stanford University.

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