Master Degree, National Chiao Tung University
Electro plating in Advanced package. (2 years)
Soldering technology for semiconductor package. (5 years)
Silicone materials solutions in Advanced assembly. (2 years)
Mr. Chen have been in PCB assembly and semiconductor package field for past 7 years, including electro Copper plating, electroless ENEPIG plating as UBM, and soldering technology in micro bump and 3D IC package. Now Mr. Chen is an expert in novel silicone materials for MEMS package and semiconductor package.