- EMBA from National Taiwan University
- Master in EE from National Tsing Hua University
- Joined GUC in 2008, over 10years of experience in ASIC Design,Package and Production Engineering
- Prior to joining GUC, over 17 years of experience in TSMC 12 inch Fab Product and Process Engineering
Chiang Fu is Senior Vice PresidentofGlobalUnichipCorp.He joined GUC since2008 as Product, Package design and Testing development director for 40nm and 28nm ASIC production. In 2015, He is also in charge of GUC SOC RD for 12nm and 7nm ASIC spec in design and verification. He has published more than 10 conference papersascorresponding author and granted more than 5patents in USA and China. He is also the member of the SEMI Taiwan Package & Testing committee. Since 2019, he response for GUC Sales and Marketing.
His previous positions include the engineer and department manager of 8 and 12 inch yield and process engineering, TSMC(1993-2008).