+886.3.560.1777

English


FAN OUT PACKAGING PAVILION

As high performance computing, automotive electronics, 5G communications, IoT and AR/VR applications are rapidly growing, their requirements for smaller form factors, higher data rates, low power and cost reduction will significantly increase the adoption of advanced packaging technologies. Researchers at Yole Développement estimated that overall revenues of the advanced packaging industry will enjoy a 7% CAGR between 2016 and 2022. Fan-out (FO) will be the fastest growing advanced packaging platform, registering a 36% CAGR between 2016 and 2022. By 2022, the FO packaging market will grow to over US$3 billion.

In view of this market trend, SEMICON Taiwan 2019 will include an exhibition area for FO packaging for the first time where local and foreign vendors can demonstrate manufacturing equipment, materials and components that are critical to FO packaging process.

 

SEMICON Taiwan 2019 Fan Out Packaging Pavilion Exhibitors 

I2930 AGC Inc.
I2828 Chung King Enterprise Co.,Ltd
I2824 Hajime Corporation
I3028 HAN-YANG Electronic Industry CO.,LTD
J2838 Industrial Technology Research Institute - ITRI
J2834 KeenHammer Tech Co.,Ltd
I3024 Knowledge Creation Innovation Co., Ltd.
I2916 Manz Taiwan Ltd.
I2820 Mingkun Technologies Co., Ltd.
J2939 NAGASE (TAIWAN) CO., LTD.
I3127 NISSEI CORPORATION
I2816 SEMSYSCO GmbH
I2921 ShingTech Electronics Co., Ltd.
I3016 Shuz Tung Machinery Industrial Co.,Ltd.
I2922 SPARKLE TW DEVELOPMENT LIMITED
I2822 TAI CHYANG ELECTRIC ENG. CO., LTD.
I3020 Taiwan WKK Distribution Co., Ltd.
I3030 Ushio Taiwan, Inc.

 

 

Share page with AddThis